By Hamza Faisal
Massachusetts startup Veir has raised an oversubscribed $110 million Series C to scale manufacturing of its superconducting power delivery systems for AI data centers, the company announced this week.
The round was co-led by Matter Venture Partners and Tyche Partners and takes the company's total funding to $225 million.
Other new investors include LG Technology Ventures, Gates Frontier, Sabanci Climate Ventures, and Hui Capital, alongside existing backers Engine Ventures, Galvanize Climate Solutions, Piva Capital, Congruent Ventures, and VXI Capital.
Veir says the money will fund an expansion of its manufacturing capacity, advance its product portfolio, and build out the technical and commercial teams needed to support large-scale adoption.

Power is the AI boom's real bottleneck

The raise lands as the AI infrastructure buildout strains conventional power delivery.
Data center campuses keep growing larger and more power-hungry, and copper-based electrical systems are becoming a constraint — demanding more labor, materials, and floor space just as operators rush to stand up new capacity.
Veir's answer is to run power through superconducting tapes chilled inside liquid nitrogen jackets at minus 196 degrees Celsius.
The cables can move far more electricity through a much smaller physical footprint, and the company says they cut labor, material requirements, and installation complexity for operators.

The demo: 3 megawatts through a single cable

Days before the funding announcement, Veir completed its first data center transmission demonstration in a simulated environment near its Woburn, Massachusetts headquarters.
A single low-voltage cable transmitted 3 megawatts of power in the test, which the company dubbed STAR, for Superconducting Technology for AI Racks.
According to Veir, the system delivers up to ten times the power and covers more than five times the distance of conventional copper lines at the same voltage, while needing roughly twenty times less space.
"The pace at which data centers are being built and expanding and the urgency of being able to serve higher density and higher power loads is extremely high right now," CEO Tim Heidel said.

From transmission lines to the data center floor

Veir originally set out to build superconducting lines for long-distance power transmission, a market where high costs and complexity had kept the technology niche.
Last year it raised a $75 million Series B led by Munich Re Ventures, with backing from Microsoft's Climate Innovation Fund and Breakthrough Energy Ventures, and began adapting its core technology to the lower-voltage world inside data centers.
Microsoft has been testing Veir's cables for a data center pilot, and the startup has said commercial deployments could begin in 2027.
With the new capital, Veir says it is moving from technology validation to commercial deployment and scaled manufacturing — betting that the fastest-growing constraint in AI is not chips, but the power to run them.
By Hamza Faisal